selected scholarly activity
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academic article
- Morphology and electrical properties of inkjet-printed palladium/palladium oxide. Journal of Materials Chemistry C. 5:1893-1902. 2017
- Paper-Based, Hand-Drawn Free Chlorine Sensor with Poly(3,4-ethylenedioxythiophene):Poly(styrenesulfonate).. Analytical Chemistry Industrial and Engineering Chemistry Analytical Edition. 88:10384-10389. 2016
- Inkjet-printed bifunctional carbon nanotubes for pH sensing. Materials Letters. 176:68-70. 2016
- Inkjet Printing of a Highly Loaded Palladium Ink for Integrated, Low-Cost pH Sensors. Advanced Functional Materials Advanced Materials for Optics and Electronics. 26:4923-4933. 2016
- Nanocrystalline diamond films prepared by pulsed electron beam ablation on different substrates. Journal of Materials Research. 31:1964-1971. 2016
- Direct bonding of liquid crystal polymer to glass. RSC Advances. 6:107200-107207. 2016
- Low-temperature solution processing of palladium/palladium oxide films and their pH sensing performance.. Talanta. 146:517-524. 2016
- Materials analyses and electrochemical impedance of implantable metal electrodes.. Physical Chemistry Chemical Physics. 17:10135-10145. 2015
- Nanobonding: A key technology for emerging applications in health and environmental sciences. Japanese Journal of Applied Physics Japanese Journal of Applied Physics, Part 2: Letters Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes. 54. 2015
- Microfabricated electrochemical pH and free chlorine sensors for water quality monitoring: recent advances and research challenges. RSC Advances. 5:69086-69109. 2015
- Polymer integration for packaging of implantable sensors. Sensors and Actuators, B: Chemical. 202:758-778. 2014
- Formation of gallium arsenide nanostructures in Pyrex glass.. Nanotechnology. 24:315301. 2013
- Charge transfer and stability of implantable electrodes on flexible substrate. Sensors and Actuators, B: Chemical. 178:132-139. 2013
- Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding. ECS Journal of Solid State Science and Technology. 2:P515-P523. 2013
- Low temperature nanointegration for emerging biomedical applications. Microelectronics and Reliability. 52:361-374. 2012
- Nanobonding Technology Toward Electronic, Fluidic, and Photonic Systems Integration. IEEE Journal on Selected Topics in Quantum Electronics. 17:689-703. 2011
- Surface activated bonding of copper through silicon vias and gold stud bumps at room temperature. Journal of Vacuum Science and Technology A. 29. 2011
- Annealing Temperature-Dependent Interfacial Behavior of Sequentially Plasma-Activated Silicon Bonded Wafers. Journal of Microelectromechanical Systems. 20:17-20. 2011
- Surface activation-based nanobonding and interconnection at room temperature. Journal of Micromechanics and Microengineering. 21. 2011
- Void-free strong bonding of surface activated silicon wafers from room temperature to annealing at 600 degrees C. Thin Solid Films. 519:804-808. 2010
- Comparative annealing effect on bonded wafers in air and ultrahigh vacuum for microelectromechanical systems/microfluidics packaging. Journal of Micro/ Nanolithography, MEMS, and MOEMS. 9. 2010
- Sequential Plasma-Activated Bonding Mechanism of Silicon/Silicon Wafers. Journal of Microelectromechanical Systems. 19:840-848. 2010
- Hybrid plasma bonding for void-free strong bonded interface of silicon/glass at 200 degrees C. Talanta. 82:508-515. 2010
- Hybrid plasma bonding of germanium and glass wafers at low temperature. Materials Letters. 64:1532-1535. 2010
- Investigation of bonding strength and sealing behavior of aluminum/stainless steel bonded at room temperature. Vacuum. 84:1334-1340. 2010
- Void nucleation at a sequentially plasma-activated silicon/silicon bonded interface. Journal of Micromechanics and Microengineering. 20. 2010
- Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale. Nanotechnology. 21. 2010
- Influence of nitrogen microwave radicals on sequential plasma activated bonding. Materials Letters. 64:445-448. 2010
- Interfacial Behavior of Surface Activated p-GaP/n-GaAs Bonded Wafers at Room Temperature. Electrochemical and Solid-State Letters. 13:H61-H65. 2010
- Role of Heating on Plasma-Activated Silicon Wafers Bonding. Journal of the Electrochemical Society. 156:H846-H851. 2009
- A novel bonding method for ionic wafers. IEEE Transactions on Advanced Packaging IEEE Transactions on Components, Packaging and Manufacturing Technology. Part B, Advanced Packaging. 30:598-604. 2007
- Room-temperature microfluidics packaging using sequential plasma activation process. IEEE Transactions on Advanced Packaging IEEE Transactions on Components, Packaging and Manufacturing Technology. Part B, Advanced Packaging. 29:448-456. 2006
- Room temperature bonding of silicon and lithium niobate. Applied Physics Letters. 89. 2006
- Room temperature wafer level glass/glass bonding. Sensors and Actuators, A: Physical. 127:31-36. 2006
- Study on Sn-Ag oxidation and feasibility of room temperature bonding of Sn-Ag-Cu solder. Materials Transactions Transactions of the Japan Institute of Metals. 46:2431-2436. 2005
- Enhanced Cu/LCP adhesion by pre-sputter cleaning prior to Cu deposition. IEEE Transactions on Advanced Packaging IEEE Transactions on Components, Packaging and Manufacturing Technology. Part B, Advanced Packaging. 28:495-502. 2005
- Wafer level surface activated bonding tool for MEMS packaging. Journal of the Electrochemical Society. 151:G461-G467. 2004
- Room temperature Cu-Cu direct bonding using surface activated bonding method. Journal of Vacuum Science and Technology A. 21:449-453. 2003
- Electrical conductivity of Wesgo AL995 alumina under fast electron irradiation in a high voltage electron microscope. Journal of Applied Physics. 92:1995-1999. 2002
- Characterization of the bonding strength and interface current of p-Si/n-InP wafers bonded by surface activated bonding method at room temperature. Journal of Applied Physics. 91:3062-3066. 2002
- Investigation of the bonding strength and interface current of p-Si/n-GaAs wafers bonded by surface activated bonding at room temperature. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 19:2114-2118. 2001
- Role of specimen thickness on the electrical conductivity of single crystalline alumina under electron irradiation. Journal of Applied Physics. 89:1612-1618. 2001
- In situ measurement of electrical conductivity of Zircaloy oxides and their formation mechanism under electron irradiation. Journal of Nuclear Materials. 265:100-107. 1999
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conference paper
- Bonding Mechanism and Electrochemical Impedance of Directly Bonded Liquid Crystal Polymer and Copper. 2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D). 40-40. 2017
- Micro- and Nano-Systems Integration - The Next Frontier. 2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D). 15-15. 2017
- The effects of oxygen plasma and humidity on surface roughness, water contact angle and hardness of silicon, silicon dioxide and glass. Journal of Micromechanics and Microengineering. 2014
- Future Nano- and Micro-Systems Using Nanobonding Technologies. AIP Conference Proceedings. 244-250. 2014
- Nanobonding - A Key Technology for Emerging Applications in Health and Environmental Sciences. 2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D). 10-10. 2014
- Comparative Electrochemical Investigation of Pt, Au and Ti Electrodes on Liquid Crystal Polymer for the Application of Neuromuscular Prostheses. ECS Transactions. 23-33. 2011
- Nanobonding for Multi-Junction Solar Cells at Room Temperature. ECS Transactions. 3-10. 2011
- Annealed Proton-Exchanged LiNbO3 Ridge Waveguide for Photonics Application. Proceedings of SPIE - The International Society for Optical Engineering. 2010
- MEMS/Microfluidics Packaging Without Heating. Proceedings of SPIE - The International Society for Optical Engineering. 2010
- Surface and Interface Characterization of Sequentially Plasma Activated Silicon, Silicon dioxide and Germanium Wafers for Low Temperature Bonding Applications. ECS Transactions. 329-338. 2010
- Surface Activated Bonding of 8 in. Si Wafers for MEMS and Microfluidic Packaging. 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4. 1423-+. 2009
- Surface Activation Based Nanobonding Technologies for Optoelectronics Packaging. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. 55-56. 2009
- Surface activated bonding method for flexible lamination. 6TH INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, PROCEEDINGS 2007. 271-+. 2007
- A novel method for bonding of ionic wafers. Proceedings - Electronic Components and Technology Conference. 552-+. 2006
- Surface activated bonding of LCP/Cu for electronic packaging. Journal of Materials Science Interface Science Journal of Materials Science Letters. 3177-3184. 2005
- Sequential plasma activation process for microfluidics packaging at room temperature. Proceedings - Electronic Components and Technology Conference. 611-616. 2005
- Combined process for wafer direct bonding by means of the surface activation method. Proceedings - Electronic Components and Technology Conference. 484-490. 2004
- Development of an UHV surface activated bonding machine for MEMS packaging. SEMICONDUCTOR WAFER BONDING VII: SCIENCE, TECHNOLOGY, AND APPLICATIONS, PROCEEDINGS. 309-320. 2003
- Wafer-scale surface activated bonding of Cu-Cu, Cu-Si, and Cu-SiO2 at low temperature. SEMICONDUCTOR WAFER BONDING VII: SCIENCE, TECHNOLOGY, AND APPLICATIONS, PROCEEDINGS. 239-247. 2003
- Effects of specimen thickness and impurity on the conductivity of alumina under electron irradiation. Journal of Nuclear Materials. 1250-1253. 2002
- A lamination technique of LCP/Cu for electronic packaging. POLYTRONIC 2002: 2ND INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, CONFERENCE PROCEEDINGS. 177-182. 2002
- Reliability and microstructure of Au-Al and Au-Cu direct bonding fabricated by the surface activated bonding. Proceedings - Electronic Components and Technology Conference. 915-919. 2002
- A new wafer-bonder of ultra-high precision using surface activated bonding (SAB) concept. Proceedings - Electronic Components and Technology Conference. 1013-1018. 2001
- An 8-inch wafer bonding apparatus with ultra-high alignment accuracy using surface activated bonding (SAB) concept. TRANSDUCERS '01: EUROSENSORS XV, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2. 222-225. 2001
- Bonding of P-Si/N-InP wafers through surface activated bonding method at room temperature. Conference Proceedings - International Conference on Indium Phosphide and Related Materials. 272-275. 2001
- Low temperature direct Cu-Cu bonding with low energy ion activation method. ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001. 193-195. 2001
- Current-voltage characteristic of alumina and aluminum nitride with or without electron irradiation. Journal of Nuclear Materials. 912-916. 2000
- Significance of sample thickness and surface segregation on the electrical conductivity of Wesgo AL995 alumina under ITER environments. Journal of Nuclear Materials. 885-889. 2000
- Electrical insulating potential of aluminum nitride under irradiation with fast electrons. Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms. 159-164. 2000
- Electrical conductivity and current-voltage characteristics of alumina with or without neutron and electron irradiation. Journal of Nuclear Materials. 1848-1855. 1998
- The electrical conductivity of zircaloy oxide films. Journal of Nuclear Materials. 149-155. 1998
- In situ measurement of electrical conductivity of alumina under electron irradiation in a high voltage electron microscope. Journal of Nuclear Materials. 245-252. 1996