Copper and liquid crystal polymer bonding towards lead sensing Conferences

authors

• Redhwan, Taufique Z
• Alam, Arif U
• Haddara, Yaser
• Howlader, Matiar

status

• published 

publication date

• February 1, 2018

has subject area

• 01 Mathematical Sciences (FoR)
• 02 Physical Sciences (FoR)
• 09 Engineering (FoR)
• Applied Physics (Science Metrix)

published in

• Japanese Journal of Applied Physics  Journal

presented at event

• 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)  Conference

keywords

• ANODIC-STRIPPING VOLTAMMETRY
• ELECTROCHEMICAL SENSOR
• ELECTRODES
• INTERFACE
• LOW-TEMPERATURE
• METAL
• OXYGEN
• Physical Sciences
• Physics
• Physics, Applied
• STABILITY
• SURFACE
• Science & Technology
• TRACE LEAD

Digital Object Identifier (DOI)

• 10.7567/jjap.57.02bb03

start page

• 02BB03

end page

• 02BB03

volume

• 57

issue

• 2S1