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MEMS/microfluidics packaging without heating
Conference

MEMS/microfluidics packaging without heating

Authors

Howlader MR

Volume

7592

Publisher

SPIE, the international society for optics and photonics

Publication Date

February 11, 2010

DOI

10.1117/12.845291

Name of conference

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX

Conference proceedings

Proceedings of SPIE--the International Society for Optical Engineering

ISSN

0277-786X
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