MEMS/microfluidics packaging without heating Conferences

authors

• Howlader, Matiar

status

• published 

publication date

• February 11, 2010

published in

• Proceedings of SPIE - The International Society for Optical Engineering  Journal

presented at event

• MOEMS-MEMS  Conference

keywords

• LOAD
• LOW-TEMPERATURE
• Materials Science
• Materials Science, Characterization & Testing
• Nanoscience & Nanotechnology
• Optics
• PLASMA ACTIVATION
• Physical Sciences
• SILICON-WAFERS
• Science & Technology
• Science & Technology - Other Topics
• Sequential plasma activated bonding
• TECHNOLOGY
• Technology
• bonding strength
• electron energy loss spectroscopy
• nanointerface
• nanopores
• surface roughness
• void and viscous flow
• water contact angle

Digital Object Identifier (DOI)

• 10.1117/12.845291

volume

• 7592