Development of an UHV surface activated bonding machine for MEMS packaging Conferences

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authors

Howlader, Matiar
Okada, H
Itoh, T
Suga, T

status

published

publication date

January 1, 2003

published in

SEMICONDUCTOR WAFER BONDING VII: SCIENCE, TECHNOLOGY, AND APPLICATIONS, PROCEEDINGS Journal

presented at event

7th International Symposium on Semiconductor Wafer Bonding Conference