Journal article
Wafer Level Surface Activated Bonding Tool for MEMS Packaging
Abstract
A wafer level surface activated bonding (SAB) tool has been developed for microelectromechanical systems (MEMS) packaging at low temperature. The tool accommodates 8 in. diam wafers. The principle features of the tool are the automatic parallel adjustment for 8 in. wafers to a margin of error within ±1 μm and the X, Y, and θ axis alignments with an accuracy of ±0.5 μm. We have approached a new integration technique for the integration of ionic …
Authors
Howlader MMR; Okada H; Kim TH; Itoh T; Suga T
Journal
Journal of The Electrochemical Society, Vol. 151, No. 7, pp. g461–g467
Publisher
The Electrochemical Society
Publication Date
2004
DOI
10.1149/1.1758723
ISSN
0013-4651