Integration of Two-Dimensional Materials: Recent Advances and Challenges Conferences

abstract

• In this paper, we review on the recent development of heterogeneous integration of 2D materials associated with novel and exciting fundamental phenomena. We will discuss the three-dimensional integration challenges of 2D materials, as well as the parameters limiting the device performances for sensing applications.

authors

• Mohamed, Moataz
• Howlader, Matiar

status

• published 

publication date

• May 2019

published in

• 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)  Journal

presented at event

• 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)  Conference

keywords

• Engineering
• Engineering, Electrical & Electronic
• Science & Technology
• Technology

Digital Object Identifier (DOI)

• 10.23919/LTB-3D.2019.8735146

International Standard Book Number (ISBN) 13

• 9784904743072

start page

• 35

end page

• 35

volume

• 00