A lamination technique of LCP/Cu for electronic packaging Conferences

authors

• Suga, T
• Takahashi, A
• Howlader, Matiar
• Saijo, K
• Oosawa, S

status

• accepted 

publication date

• 2002

published in

• 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)  Journal

presented at event

• 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings  Conference

keywords

• Engineering
• Engineering, Electrical & Electronic
• Instruments & Instrumentation
• Materials Science
• Materials Science, Characterization & Testing
• Optics
• Physical Sciences
• Polymer Science
• SURFACE ACTIVATION METHOD
• Science & Technology
• TEMPERATURE
• Technology

Digital Object Identifier (DOI)

• 10.1109/polytr.2002.1020205

International Standard Book Number (ISBN) 10

• 0-7803-7567-X

start page

• 177

end page

• 182