Surface activation-based nanobonding and interconnection at room temperature

Flip chip nanobonding and interconnect system (NBIS) equipment with high precision alignment has been developed based on the surface activated bonding method for high-density interconnection and MEMS packaging. The 3σ alignment accuracy in the IR transmission system was approximately ±0.2 µm. The performance of the NBIS has been preliminarily investigated through bonding between relatively rough surfaces of copper through silicon vias (Cu-TSVs) …