Conference
Sequential Plasma Activation Process for Microfluidics Packaging at Room Temperature
Abstract
A sequential plasma activation process consisting of oxygen reactive ion etching (RIE) plasma and nitrogen radical activation was applied for microfluidics packaging at room temperature. Si/glass and glass/glass wafers were activated by the oxygen RIE plasma and nitrogen microwave radicals one after another. The activated wafers by the two-step process were brought into contact in air followed by keeping them in air for 24 h. The wafers were …
Authors
Howlader MR; Suehara S; Takagi H; Kim TH; Maeda R; Suga T
Volume
2
Pagination
pp. 611-616
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2005
DOI
10.1109/ectc.2005.1441332
Name of conference
Proceedings Electronic Components and Technology, 2005. ECTC '05.