A Novel Bonding Method for Ionic Wafers Journal Articles

authors

• Howlader, Matiar
• Suga, T
• Kim, MJ

status

• published 

publication date

• November 2007

has subject area

• 0906 Electrical and Electronic Engineering (FoR)
• 0910 Manufacturing Engineering (FoR)
• Electrical & Electronic Engineering (Science Metrix)
• Networking & Telecommunications (Science Metrix)

published in

• IEEE Transactions on Advanced Packaging  Journal

keywords

• Auger electron spectroscopy
• Engineering
• Engineering, Electrical & Electronic
• Engineering, Manufacturing
• GLASS
• LINBO3 SINGLE-CRYSTALS
• LITHIUM-NIOBATE
• Materials Science
• Materials Science, Multidisciplinary
• SILICON
• Science & Technology
• Technology
• charge decomposition
• depolarization
• electron energy loss spectroscopy (EELS) and bonding strength
• ionic wafers
• lattice mismatch
• modified hollow cathode ion source
• polarization
• surface activated bonding

Digital Object Identifier (DOI)

• 10.1109/tadvp.2007.906394

start page

• 598

end page

• 604

volume

• 30

issue

• 4