Annealing Temperature-Dependent Interfacial Behavior of Sequentially Plasma-Activated Silicon Bonded Wafers
Journal Articles
- Overview
- Research
- Identity
- Additional Document Info
- View All
Overview
status
publication date
- February 2011
has subject area
- 0906 Electrical and Electronic Engineering (FoR)
- 0910 Manufacturing Engineering (FoR)
- 0913 Mechanical Engineering (FoR)
- Nanoscience & Nanotechnology (Science Metrix)