Investigation of bonding strength and sealing behavior of aluminum/stainless steel bonded at room temperature

This article reports the direct bonding of aluminum (Al) [99.999% (5N), 99% (2N)] and stainless steel SUS (304, 316) without heating for sealing in the ultra high vacuum (UHV) components. For bonding, the smooth surfaces of the Al and SUS specimens were activated using argon fast atom beam (Ar-FAB) for 1–60 and 60min, respectively, in a background pressure of 6.0×10−5Pa followed by close contact under an external pressure of 960N. High bonding strength resulted in the bonded mates of Al and SUS304 activated for 30 and 60min, respectively, due to the adhesion forces of the surface atoms. Tensile pulling tests showed bulk fractures in Al with impurity dependent bonding strength. The bonding strengths for the Al5N/SUS304 and Al2N/SUS304 specimens were higher than 60 and 100MPa, respectively. For the sealing test, the smooth surface of the SUS316 flange containing a hole was bonded with Al after surface activation 60 and 30min, respectively. Leak rates for Al5N/SUS316 and Al2N/SUS316 specimens were 1.5×10−11 and 2.0×10−11Pam3/s, respectively. These results satisfy the permissible leakage of a large-sized UHV chamber. Time dependence of the leak test behavior for both specimens shows a stable leak rate. Therefore, the sealing of Al/SUS316 may be utilized for the fabrication of corrosion free joints for fluid flow in the cooling of electron guns of small size equipment such as portable scanning electron microscopes in UHV pressure.