An 8-inch Wafer Bonding Apparatus with Ultra-High Alignment Accuracy Using Surface Activated Bonding (SAB) Concept Conferences

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authors

Suga, Tadatomo
Itoh, Toshihiro
Howlader, Matiar

status

published

publication date

2001

published in

TRANSDUCERS '01: EUROSENSORS XV, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2 Journal

presented at event

11th International Conference on Solid-State Sensors and Actuators Conference