A new wafer-bonder of ultra-high precision using surface activated bonding (SAB) concept Conferences

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authors

Suga, T
Howlader, Matiar
Itoh, T
Inaka, C
Arai, Y
Yamauchi, A

status

accepted

publication date

2001

published in

Proceedings - Electronic Components and Technology Conference Journal

presented at event

51st Electronic Components and Technology Conference 2001. Proceedings Conference