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Bonding mechanism and electrochemical impedance of...
Conference

Bonding mechanism and electrochemical impedance of directly bonded liquid crystal polymer and copper

Abstract

We report direct bonding of liquid crystal polymer and copper film for electrochemical sensing for the first time. A peel strength of 683 g/cm was observed indicating strong adhesion. X-ray photoelectron and electrochemical impedance spectroscopies were used to characterize the sensing electrodes.

Authors

Redhwan TZ; Alam AU; Haddara YM; Howlader MMR

Pagination

pp. 40-40

Publication Date

May 2017

DOI

10.23919/LTB-3D.2017.7947436

Conference proceedings

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)