Room temperature wafer level glass/glass bonding Journal Articles

authors

• Howlader, Matiar
• Suehara, Satoru
• Suga, Tadatomo

status

• published 

publication date

• February 2006

has subject area

• 0906 Electrical and Electronic Engineering (FoR)
• 0912 Materials Engineering (FoR)
• 0913 Mechanical Engineering (FoR)
• Nanoscience & Nanotechnology (Science Metrix)

published in

• Sensors and Actuators, A: Physical  Journal

keywords

• Engineering
• Engineering, Electrical & Electronic
• Instruments & Instrumentation
• N-2 radical MW plasma
• OH density
• RIE O-2 rf plasma
• SILICON-WAFERS
• Science & Technology
• Technology
• bonding strength
• glass wafer
• sequential activation process
• surface activated bonding

Digital Object Identifier (DOI)

• 10.1016/j.sna.2005.11.003

start page

• 31

end page

• 36

volume

• 127

issue

• 1