Surface Activated Bonding Method for Flexible Lamination Conferences

authors

• Howlader, Matiar
• Suga, T

status

• published 

publication date

• January 2007

published in

• Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics  Journal

presented at event

• 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Polytronic 2007  Conference

keywords

• ADHESION
• CU
• DEPOSITION
• DNA
• Engineering
• Engineering, Electrical & Electronic
• Engineering, Industrial
• INTERCONNECTS
• IRRADIATION
• METALLIZATION
• Materials Science
• Materials Science, Multidisciplinary
• Nanoscience & Nanotechnology
• POLYTETRAFLUOROETHYLENE
• Physical Sciences
• Polymer Science
• Science & Technology
• Science & Technology - Other Topics
• Technology

Digital Object Identifier (DOI)

• 10.1109/polytr.2007.4339181

International Standard Book Number (ISBN) 13

• 978-1-4244-1130-6

start page

• 271

end page

• +