Micro- and nano-systems integration — The next frontier Conferences

authors

• Howlader, Matiar

status

• published 

publication date

• May 2017

published in

• 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)  Journal

presented at event

• 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)  Conference

keywords

• Engineering
• Engineering, Electrical & Electronic
• Science & Technology
• Technology

Digital Object Identifier (DOI)

• 10.23919/ltb-3d.2017.7947411

start page

• 15

end page

• 15