publication venue for
- Strain estimation in III–V materials by analysis of the degree of polarization of luminescence 2010
- High-K dielectric deposition in 3D architectures: The case of Ta2O5 deposited with metal–organic precursor TBTDET 2007
- The relentless march of the MOSFET gate oxide thickness to zero 2000
- Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications. 94:46-55. 2019
- Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. 53:1002-1008. 2013
- Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding. 52:2744-2748. 2012
- Low temperature nanointegration for emerging biomedical applications. 52:361-374. 2012
- Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. 51:43-52. 2011
- Influence of gold pick up on the hardness of copper free air ball. 51:30-37. 2011
- Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. 51:67-74. 2011
- Role of process parameters on bondability and pad damage indicators in copper ball bonding. 51:60-66. 2011
- Silver pick up during tail formation in thermosonic wire bonding process. 51:38-42. 2011
- Wearout estimation using the Robustness Validation methodology for components in 150°C ambient automotive applications. 50:1744-1749. 2010
- Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings. 48:631-637. 2008
- Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. 48:416-424. 2008
- Study of the electrolyte-insulator-semiconductor field-effect transistor (EISFET) with applications in biosensor design. 47:2025-2057. 2007
- Sequential environmental stresses tests qualification for automotive components. 47:1680-1684. 2007
- A review of gate tunneling current in MOS devices. 46:1939-1956. 2006
- Hot-carrier reliability of submicron NMOSFETs and integrated NMOS low noise amplifiers. 46:201-212. 2006
- Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements. 44:787-796. 2004
- Low frequency noise in complementary npn and pnp polysilicon emitter bipolar junction transistors. 40:1855-1861. 2000
- BLUEs of location and scale parameters of laplace distribution based on type-II censored samples and associated inference. 36:371-374. 1996
- Reliability estimation and tolerance limits for Laplace distribution based on censored samples. 36:375-378. 1996
- Efficient estimation of the mean of an exponential distribution when two outliers are present. 35:57-63. 1995
- Polycrystalline silicon resistors for integrated circuits. 12:416-416. 1973
- Effective mass and intrinsic concentration in silicon. 7:166-166. 1968