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Extraction of bonding strain data in diode lasers...
Journal article

Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements

Abstract

A technique to determine strain in diode lasers by matching measured polarization-resolved photoluminescence to a finite element method model is described. The code is shown to be able to fit well a finite element model with degree of polarization measurements to extract strain information from diode lasers and predict strain values owing to die bonding. It is useful in characterizing die bonding processes and in detecting solder voids which …

Authors

Fritz MA; Cassidy DT

Journal

Microelectronics Reliability, Vol. 44, No. 5, pp. 787–796

Publisher

Elsevier

Publication Date

5 2004

DOI

10.1016/j.microrel.2003.08.013

ISSN

0026-2714