Journal article
Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements
Abstract
A technique to determine strain in diode lasers by matching measured polarization-resolved photoluminescence to a finite element method model is described. The code is shown to be able to fit well a finite element model with degree of polarization measurements to extract strain information from diode lasers and predict strain values owing to die bonding. It is useful in characterizing die bonding processes and in detecting solder voids which …
Authors
Fritz MA; Cassidy DT
Journal
Microelectronics Reliability, Vol. 44, No. 5, pp. 787–796
Publisher
Elsevier
Publication Date
5 2004
DOI
10.1016/j.microrel.2003.08.013
ISSN
0026-2714