Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding Journal Articles

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authors

Shah, A
Rezvani, A
Mayer, M
Zhou, Norman
Persic, J
Moon, JT

status

published

publication date

January 2011

has subject area

0906 Electrical and Electronic Engineering (FoR)
Applied Physics (Science Metrix)

published in

Microelectronics Reliability Journal