Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
Journal Articles
- Overview
- Research
- Identity
- Additional Document Info
- View All
Overview
status
publication date
- March 2008
has subject area
- 0906 Electrical and Electronic Engineering (FoR)
- Applied Physics (Science Metrix)
published in
- Microelectronics Reliability Journal