authors
- Zhang, Hongqiang
- Zhao, Zhenyu
- Zou, Guisheng
- Wang, Wengan
- Liu, Lei
- Zhang, Gong
- Zhou, Norman
Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications
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status
publication date
- March 2019
has subject area
- 0906 Electrical and Electronic Engineering (FoR)
- Applied Physics (Science Metrix)
published in
- Microelectronics Reliability Journal