Journal article
Silver pick up during tail formation in thermosonic wire bonding process
Abstract
Cu ball bonding processes are significantly less robust than Au ball bonding processes. One reason for this are higher variations observed, e.g. in the free-air ball (FAB) formation process. There is a strong influence the tail bond process has on subsequent FAB formation. Tail tips and bond fractographs made with Cu and Au wires are investigated using scanning electron microscopy. Au and Cu wires pick up Ag material (Ag pick up) from the Ag …
Authors
Lee J; Mayer M; Zhou Y; Hong SJ; Moon JT
Journal
Microelectronics Reliability, Vol. 51, No. 1, pp. 38–42
Publisher
Elsevier
Publication Date
January 2011
DOI
10.1016/j.microrel.2010.06.007
ISSN
0026-2714