Journal of Electronic Materials
Journal
-
- Overview
-
- Identity
-
- View All
-
Overview
publication venue for
-
Mechanical Stress in InP Structures Etched in an Inductively Coupled Plasma Reactor with Ar/Cl2/CH4 Plasma Chemistry
2018
-
Optical Characterizations of VCSEL for Emission at 850 nm with Al Oxide Confinement Layers
2018
-
Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability
2009
-
The role of lattice mismatch in the deposition of CdTe thin films
2006
-
Optical and microstructural characterization of the effects of rapid thermal annealing of CdTe thin films grown on Si (100) substrates
2005
-
Enhancing and Understanding the High Stretchability of Printable, Conductive Silver Nanowire Ink.
52:4634-4643.
2023
-
Novel Dual-Metal Junctionless Nanotube Field-Effect Transistors for Improved Analog and Low-Noise Applications.
50:108-119.
2021
-
Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature.
48:7562-7572.
2019
-
A Predictive Model for Thermal Conductivity of Nano-Ag Sintered Interconnect for a SiC Die.
48:2811-2825.
2019
-
Preparation of Oxidation-Resistant Ag-Cu Alloy Nanoparticles by Polyol Method for Electronic Packaging.
48:1286-1293.
2019
-
Effect of Silicon Carbide Nanoparticles on the Grain Boundary Segregation and Thermoelectric Properties of Bismuth Doped Mg2Si0.7Ge0.3.
45:6052-6058.
2016
-
International Round-Robin Study of the Thermoelectric Transport Properties of an n-Type Half-Heusler Compound from 300 K to 773 K.
44:4482-4491.
2015
-
Composite Semiconductor Material of Carbon Nanotubes and Poly[5,5′-bis(3-dodecyl-2-thienyl)-2,2′-bithiophene] for High-Performance Organic Thin-Film Transistors.
42:3481-3488.
2013
-
Transport Properties of Bulk Thermoelectrics: An International Round-Robin Study, Part II: Thermal Diffusivity, Specific Heat, and Thermal Conductivity.
42:1073-1084.
2013
-
Transport Properties of Bulk Thermoelectrics—An International Round-Robin Study, Part I: Seebeck Coefficient and Electrical Resistivity.
42:654-664.
2013
-
Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles.
41:1924-1930.
2012
-
Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application.
41:1886-1892.
2012
-
Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds.
40:1444-1451.
2011
-
Silver Nanoparticle Paste for Low-Temperature Bonding of Copper.
40:1394-1402.
2011
-
In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal.
38:647-654.
2009
-
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag.
37:1163-1163.
2008
-
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag.
37:324-330.
2008
-
The Feasibility of Au Ball Bonding on Sn-Plated Cu.
36:682-689.
2007
-
Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate.
35:433-442.
2006
-
Weldability of thin sheet metals by small-scale resistance spot welding using high-frequency inverter and capacitor-discharge power supplies.
30:1012-1020.
2001
-
Impurity band in the interfacial region of GaN films grown by hydride vapor phase epitaxy.
30:115-122.
2001
-
Weldability of thin sheet metals during small-scale resistance spot welding using an alternating-current power supply.
29:1090-1099.
2000
-
Preparation and characterization of thin films of MgO, Al2O3 and MgAl2O4 by atomic layer deposition.
22:215-220.
1993
-
Kinetics of chlorination of Co and Co-10 at. pct Pt alloy by reaction with HCl gas.
20:349-356.
1991
-
Nitrogen implantation into GaP: Damage and nitrogen location studies.
4:195-207.
1975
has subject area
Identity
International Standard Serial Number (ISSN)
Electronic International Standard Serial Number (EISSN)