Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles

Low-temperature bonding by sintering of Ag nanoparticles (NPs) is a promising lead-free bonding technique used in the electronic packaging industry. In this work, we prepare Ag nanoparticle (NP) paste using both an aqueous method and a polyol method. Sintering bonding trials were then conducted using different forms of Ag NPs. The results showed that use of the aqueous-based Ag NP paste led to inhomogeneous distribution of NPs, known as the …