Journal article
Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature
Abstract
Bonding a large-area die by Ag nanoparticle paste sintering faces a lot of challenges, and the voids/cracks caused by residual organics of the paste are some of the obstacles. The organic burnt out during the sintering process and degassing of the residue organics during service cause significant concerns. In this study, organic-free Ag nanoparticle material has been developed by pulsed laser deposition technology. Oweing to being organic-free, …
Authors
Mohd Zubir NS; Zhang H; Zou G; Bai H; Deng Z; Feng B; Wu A; Liu L; Zhou YN
Journal
Journal of Electronic Materials, Vol. 48, No. 11, pp. 7562–7572
Publisher
Springer Nature
Publication Date
November 2019
DOI
10.1007/s11664-019-07532-9
ISSN
0361-5235