Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature

Bonding a large-area die by Ag nanoparticle paste sintering faces a lot of challenges, and the voids/cracks caused by residual organics of the paste are some of the obstacles. The organic burnt out during the sintering process and degassing of the residue organics during service cause significant concerns. In this study, organic-free Ag nanoparticle material has been developed by pulsed laser deposition technology. Oweing to being organic-free, no void, crack and delamination were observed in the sintered Ag layer of die-attachment, and the large-area die-attachment could be carried out by a simple sintering profile at low temperature. The die shear test indicated that the bonding strength was superior to the standard. Porosity and densification of the sintered Ag layer could be controlled by sintering profiles, including the processing pressure, temperature and time.