Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate
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Overview
status
publication date
- March 2006
has subject area
- 0202 Atomic, Molecular, Nuclear, Particle and Plasma Physics (FoR)
- 0906 Electrical and Electronic Engineering (FoR)
- 1099 Other Technology (FoR)
- Applied Physics (Science Metrix)
published in
- Journal of Electronic Materials Journal