Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds Journal Articles
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Overview
status
publication date
- June 2011
has subject area
- 0202 Atomic, Molecular, Nuclear, Particle and Plasma Physics (FoR)
- 0906 Electrical and Electronic Engineering (FoR)
- 1099 Other Technology (FoR)
- Applied Physics (Science Metrix)
published in
- Journal of Electronic Materials Journal