Journal article
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag
Authors
Kim J-M; Jung J-P; Zhou YN; Kim J-H
Journal
Journal of Electronic Materials, Vol. 37, No. 8, pp. 1163–1163
Publisher
Springer Nature
Publication Date
August 1, 2008
DOI
10.1007/s11664-008-0488-2
ISSN
0361-5235