publication venue for
- A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process 2018
- 3D Printing as a New Packaging Approach for MEMS and Electronic Devices 2017
- Free-air ball formation and deformability with Pd coated Cu wire 2011
- Thermosonic Au ball bonding process investigated using microsensor and laser vibrometer 2010
- Surface activated bonding of 8 in. Si wafers for MEMS and microfluidic packaging 2009
- Reduction of underpad stress in thermosonic copper ball bonding 2008
- Silver pick-up during tail formation and its effect on free air ball in thermosonic copper ball bonding 2008
- A Novel Method for Bonding of Ionic Wafers 2006
- Sequential plasma activation process for microfluidics packaging at room temperature 2005
- Combined process for wafer direct bonding by means of the surface activation method 2004
- Reliability and microstructure of Au-Al and Au-Cu direct bonding fabricated by the Surface Activated Bonding 2002
- A new wafer-bonder of ultra-high precision using surface activated bonding (SAB) concept 2001
- Characterisation of the electrical performance of buried capacitors and resistors in low temperature co-fired (LTCC) ceramic 1998