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Silver pick-up during tail formation and its effect on free air ball in thermosonic copper ball bonding
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Additional Document Info
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Overview
authors
Lee, J
Mayer, M
Zhou, Norman
Hong, SJ
Moon, JT
status
published
publication date
May 2008
published in
Proceedings - Electronic Components and Technology Conference
Journal
presented at event
2008 58th Electronic Components and Technology Conference (ECTC 2008)
Conference
Research
keywords
40 Engineering
4014 Manufacturing Engineering
Identity
Digital Object Identifier (DOI)
10.1109/ectc.2008.4550262
Additional Document Info
start page
2024
end page
2029