A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process

In order to answer to industrial requirements and to withstand environment and functioning stresses, electronic components such as MEMS, passives, or actives, have to be packaged and encapsulated. However, as the heterogeneity and complexity of devices are increasing, versatile and scalable packaging technologies are very sought after. That is why, the additive manufacturing technologies is proposed and evaluated on silicon substrates [1]. In the present work, we have experimentally demonstrated the feasibility to package functioning components and substrates using a 3D printing polymer technology. In this study, a stereolithography printer was used to build packages and lids onto silicon substrates. Morphological, electrical, and mechanical characterizations were leaded in order to analyze the impact of the process and to assess the reliability of these packages. Finally, first aging have been carried out to evaluate the polymer degradation under thermal and ultraviolet (UV) stresses. Results were compared to initial packages achieved and will be used to improve further designs and processes. This work opens plenty of new approaches to build specific and custom packages adapted to the device and its application.