A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process Conferences uri icon

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authors

  • Goubault, B
  • Aspar, G
  • Souriau, J-C
  • Castagne, L
  • Simon, G
  • Di Cioccio, L
  • Brechet, Yves

publication date

  • May 2018