Conference
Reduction of Underpad Stress in Thermosonic Copper Ball Bonding
Abstract
Ball bonding processes on test chips with Al metallized bonding pads are optimized with one Au and two Cu wire types, all 25 $\mu {\rm m}$ diameter, obtaining average shear strengths of more than 120 MPa. The process temperature is about $11 0^{\circ}{\rm C}$. The results demonstrate that ball bonds made with Cu wire show at least 15% higher shear strength than those made with Au wire. The estimated maximum shear strength $c_{pk}$ value …
Authors
Shah A; Mayer M; Zhou Y; Hong SJ; Moon JT
Pagination
pp. 2123-2130
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
May 1, 2008
DOI
10.1109/ectc.2008.4550279
Name of conference
2008 58th Electronic Components and Technology Conference