3D Printing as a New Packaging Approach for MEMS and Electronic Devices Conferences uri icon

  •  
  • Overview
  •  
  • Research
  •  
  • Identity
  •  
  • Additional Document Info
  •  
  • View All
  •  

authors

  • Aspar, G
  • Goubault, B
  • Lebaigue, O
  • Souriau, J-C
  • Simon, G
  • Di Cioccio, L
  • Brechet, Yves

publication date

  • May 2017