3D Printing as a New Packaging Approach for MEMS and Electronic Devices Conference Paper uri icon

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authors

  • Aspar, G
  • Goubault, B
  • Lebaigue, O
  • Souriau, J-C
  • Simon, G
  • Cioccio, L Di
  • Brechet, Yves

publication date

  • May 2017