publication venue for
- Cu grain growth in interconnects trenches – Experimental characterization of the overburden effect 2008
- Evolution of Cu microstructure and resistivity during thermal treatment of damascene line: Influence of line width and temperature 2007
- Dipole-induced gate leakage reduction in scaled MOSFETs with a highly doped polysilicon/nitrided oxide gate stack. 142:1-6. 2015
- Reliability study of methods to suppress boron transient enhanced diffusion in high-k/metal gate Si/SiGe channel pMOSFETs. 112:80-83. 2013
- Sub-25nm direct write (maskless) X-ray nanolithography. 108:5-7. 2013
- Characteristics of electroplated Sn bumps fabricated without a PR mould on a Si chip for 3D packaging. 93:85-90. 2012
- Golden bump for 20micron diameter wire bond enhancement at reduced process temperature. 88:3024-3029. 2011
- The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor. 87:537-542. 2010
- Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force. 86:2094-2103. 2009
- In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding. 85:1851-1857. 2008
- Bonding wire characterization using automatic deformability measurement. 85:1795-1803. 2008
- Microstructural study of copper free air balls in thermosonic wire bonding. 85:1815-1819. 2008
- Fabrication and magnetisation measurements of variable-pitch gratings of cobalt on GaAs. 21:431-434. 1993