authors
- Hang, CJ
- Song, WH
- Lum, I
- Mayer, M
- Zhou, Norman
- Wang, CQ
- Moon, JT
- Persic, J
Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force
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Overview
status
publication date
- October 2009
has subject area
- 0204 Condensed Matter Physics (FoR)
- 0299 Other Physical Sciences (FoR)
- 0906 Electrical and Electronic Engineering (FoR)
- Applied Physics (Science Metrix)
published in
- Microelectronic Engineering Journal