authors
- Carreau, V
- Maîtrejean, S
- Verdier, M
- Brechet, Yves
- Roule, A
- Toffoli, A
- Delaye, V
- Passemard, G
Evolution of Cu microstructure and resistivity during thermal treatment of damascene line: Influence of line width and temperature
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Overview
status
publication date
- November 2007
has subject area
- 0204 Condensed Matter Physics (FoR)
- 0299 Other Physical Sciences (FoR)
- 0906 Electrical and Electronic Engineering (FoR)
- Applied Physics (Science Metrix)
published in
- Microelectronic Engineering Journal