Evolution of Cu microstructure and resistivity during thermal treatment of damascene line: Influence of line width and temperature Conference Paper uri icon

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authors

  • Carreau, V
  • Maîtrejean, S
  • Verdier, M
  • Brechet, Yves
  • Roule, A
  • Toffoli, A
  • Delaye, V
  • Passemard, G

publication date

  • November 2007