Microstructural study of copper free air balls in thermosonic wire bonding
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Overview
status
publication date
- August 2008
has subject area
- 0204 Condensed Matter Physics (FoR)
- 0299 Other Physical Sciences (FoR)
- 0906 Electrical and Electronic Engineering (FoR)
- Applied Physics (Science Metrix)
published in
- Microelectronic Engineering Journal