publication venue for
- Roughness Enhanced Au Ball Bonding of Cu Substrates 2006
- Optimised Liquid Impinging Jet Arrays for Cooling CPU Packages. PP:1-1. 2024
- Modeling and Analysis of Silver-Sintered Molybdenum Packaging for SiC Power Modules With Improved Lifetime and Temperature Range. 11:2102-2113. 2021
- Optimization of Thermoelectric Generators in the Presence of Heat Losses and Fluid Flows. 8:1573-1580. 2018
- Solid and Vapor Chamber Integrated Heat Spreaders: Which to Choose and Why. 8:1581-1592. 2018
- Optimal Thermal Conditions for Maximum Power Generation When Operating Thermoelectric Liquid-to-Liquid Generators. 7:872-881. 2017
- Load-Bearing Figure-of-Merit Characterization of a Thermoelectric Module. 6:50-57. 2016
- Numerical and Experimental Study of a Hybrid Thermoelectric Cooler Thermal Management System for Electronic Cooling. 2:1608-1616. 2012
- Concurrent Optimization of Crescent Bond Pull Force and Tail Breaking Force in a Thermosonic Cu Wire Bonding Process. 32:157-163. 2009
- Low-Stress Thermosonic Copper Ball Bonding. 32:176-184. 2009
- A Thermal–Hydraulic Comparison of Liquid Microchannel and Impinging Liquid Jet Array Heat Sinks for High-Power Electronics Cooling. 32:347-357. 2009
- Characteristics of Sn–Cu Solder Bump Formed by Electroplating for Flip Chip. 29:10-16. 2006
- A footprint study of bond initiation in gold wire crescent bonding. 28:810-816. 2005
- Cooling Rate in Diode Laser Bonding. 27:147-154. 2004
- Electrode sticking during micro-resistance welding of thin metal sheets. 25:355-361. 2002
- Bonding stress and reliability of high power GaAs-based lasers. 24:92-98. 2001