Journal article
Optimized Liquid Impinging Jet Arrays for Cooling CPU Packages
Abstract
Authors
Elliott JW; Robinson AJ
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 15, No. 3, pp. 488–505
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
March 1, 2025
DOI
10.1109/tcpmt.2024.3485478
ISSN
2156-3950