Journal article
Modeling and Analysis of Silver-Sintered Molybdenum Packaging for SiC Power Modules With Improved Lifetime and Temperature Range
Abstract
With the application of wide-bandgap devices, the packaging technology of power modules is faced with elevated challenges. This article proposes a new packaging concept for silicon carbide (SiC) power modules. The main objective is to improve the lifetime and temperature range, while the proposed packaging also has the potential to reduce stray inductance and simplify the fabrication process. In the proposed concept, sintered nano-silver is …
Authors
Yang Y; Tseng Y-C; Rodriguez R; Callegaro AD; Emadi A
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 11, No. 12, pp. 2102–2113
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
December 1, 2021
DOI
10.1109/tcpmt.2021.3126284
ISSN
2156-3950