Journal article
A Footprint Study of Bond Initiationin Gold Wire Crescent Bonding
Abstract
The morphological features of the crescent bond footprints on the substrate after peeling the wire off were studied to gain an understanding of the effect of process parameters on the crescent bond formation. In the absence of any ultrasonic energy, metallurgical bonding initiated at the peripheral regions of the crescent bond. The bond strength improved at higher substrate temperatures and higher bonding force which promoted higher shear …
Authors
Zhou Y; Li X; Noolu NJ
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 28, No. 4, pp. 810–816
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
December 1, 2005
DOI
10.1109/tcapt.2005.848585
ISSN
2156-3950