Roughness Enhanced Au Ball Bonding of Cu Substrates Conferences

authors

• Noolu, NJ
• Lum, I
• Zhou, Norman

status

• published 

publication date

• September 2006

published in

• IEEE Transactions on Components, Packaging and Manufacturing Technology  Journal

presented at event

• 36th International Symposium on Microelectronics  Conference

keywords

• Au wire
• COPPER
• Cu substrates
• Engineering
• Engineering, Electrical & Electronic
• Engineering, Manufacturing
• Materials Science
• Materials Science, Multidisciplinary
• Science & Technology
• Technology

Digital Object Identifier (DOI)

• 10.1109/tcapt.2006.880521

start page

• 457

end page

• 463

volume

• 29

issue

• 3