Journal article
Load-Bearing Figure-of-Merit Characterization of a Thermoelectric Module
Abstract
Thermoelectric behavior in semiconductor materials is investigated for the purpose of converting thermal energy to electrical energy. This paper measures and quantifies the variations in the internal electrical and thermal resistances of a thermoelectric module with respect to the circuit’s electrical load in order to better characterize its behavior in a closed circuit. Since open-circuit measurements fail to accurately describe thermoelectric …
Authors
Sempels ÉV; Kempers R; Lesage FJ
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 6, No. 1, pp. 50–57
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2016
DOI
10.1109/tcpmt.2015.2501321
ISSN
2156-3950