Journal article
Numerical and Experimental Study of a Hybrid Thermoelectric Cooler Thermal Management System for Electronic Cooling
Abstract
A hybrid thermal management system for electronics cooling is considered that incorporates a thermoelectric cooler (TEC) based active path in parallel with a conventional heat pipe based passive path. The passive path is used to transport the heat from the chip at moderate thermal conditions keeping the TEC electrically off while the TEC modules are turned on when the conditions become adverse, thus operating at a higher overall system …
Authors
Russel MK; Ewing D; Ching CY
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 2, No. 10, pp. 1608–1616
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2012
DOI
10.1109/tcpmt.2012.2206810
ISSN
2156-3950