Micro- and Nano-Systems Laboratory Grant

date/time interval

• November 14, 2006 -

awarded by

• Canada Foundation for Innovation 

total award amount

• CAD 4256725

sponsor award ID

• 12128

contributor

• Deen, Jamal   Funded by
• Fang, Qiyin   Funded by

supported publications or other works

• Annealing Temperature-Dependent Interfacial Behavior of Sequentially Plasma-Activated Silicon Bonded Wafers  Journal Articles
• Comparative annealing effect on bonded wafers in air and ultrahigh vacuum for microelectromechanical systems/microfluidics packaging  Journal Articles
• Hybrid plasma bonding for void-free strong bonded interface of silicon/glass at 200°C  Journal Articles
• Hybrid plasma bonding of germanium and glass wafers at low temperature  Journal Articles
• Influence of nitrogen microwave radicals on sequential plasma activated bonding  Journal Articles
• Low temperature nanointegration for emerging biomedical applications  Journal Articles
• Nanobonding Technology Toward Electronic, Fluidic, and Photonic Systems Integration  Journal Articles
• Sequential Plasma-Activated Bonding Mechanism of Silicon/Silicon Wafers  Journal Articles
• Surface activated bonding of copper through silicon vias and gold stud bumps at room temperature  Journal Articles
• Void-free strong bonding of surface activated silicon wafers from room temperature to annealing at 600°C  Journal Articles