publication venue for
- Molecular Dynamics Simulation of Sintering and Surface Premelting of Silver Nanoparticles 2013
- Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste near Room Temperature. 56:1010-1014. 2015
- PREFACE. 56:973-973. 2015
- Synthesis with Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic Packaging. 56:1252-1256. 2015
- Mechanism of Low Temperature Sintering-Bonding through <i>In-Situ</i> Formation of Silver Nanoparticles Using Silver Oxide Microparticles. 54:872-878. 2013
- Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles. 54:879-883. 2013
- PREFACE. 54:859-859. 2013
- A New Non-PRM Bumping Process by Electroplating on Si Die for Three Dimensional Packaging. 51:1887-1892. 2010
- Effects of Steel Coatings on Electrode Life in Resistance Spot Welding of Galvannealed Steel Sheets. 51:2236-2242. 2010
- Effects of Welding Parameters on the Mechanical Performance of Laser Welded Nitinol. 49:2702-2708. 2008
- Fusion Zone Microstructure Evolution of Al-Alloyed TRIP Steel in Diode Laser Welding. 49:746-753. 2008
- Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding. 49:2347-2353. 2008
- Microstructure and Mechanical Properties of Resistance Spot Welded Advanced High Strength Steels. 49:1629-1637. 2008
- Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing. 46:2359-2365. 2005
- Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder. 46:2431-2436. 2005
- Effect of Plasma Cleaning on Fluxless Plasma Soldering of Pb-free Solder Balls on Si-wafer. 45:1880-1885. 2004