Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing Academic Article uri icon

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authors

  • Lee, Jaesik
  • Jung, Jae-Pil
  • Cheon, Chu-Seon
  • Zhou, Norman
  • Mayer, Michael

publication date

  • 2005