Conference
A Lamination Technique of LCP/CU for Electronic Packaging
Abstract
LCP is expected to be used for the lamination of electronic circuit board because of its excellent mechanical and electric properties, such as a low dielectric constant and dimensional stability. However, it has not been widely used yet due to the weak interaction between LCP and $Cu$. Roughened surfaces of $Cu$ foil that could deteriorate the electrical property are being used in conventional lamination process in order to improve the bonding …
Authors
Suga T; Takahashi A; Howlader M; Saijo K; Oosawa S
Pagination
pp. 177-182
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2002
DOI
10.1109/polytr.2002.1020205
Name of conference
2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)